High adaptability

Born in 1959 in Muar, Johor, Malaysia, to a family of Chinese descent, Lip-Bu Tan grew up in Singapore and has a diverse educational background. He graduated with a Bachelor of Physics from Nanyang University, went on to pursue a Master of Nuclear Engineering at MIT, and earned an MBA from the University of San Francisco.

Notably, he pursued a PhD in Nuclear Engineering at MIT but decided to drop out after the Three Mile Island accident in 1979, when the prospects for the nuclear industry declined significantly. This decision demonstrates flexibility and adaptability - qualities that could help him lead Intel through its current challenges.

With extensive experience in technology and investment, Mr. Tan was CEO at Cadence Design Systems - a leading chip design software company - where he drove a period of strong growth, especially in the early 2010s.

He is also the founder and chairman of Walden International, a venture capital fund with more than $5 billion under management, focusing on core technology companies such as semiconductors, cloud infrastructure, and AI. The fund’s name is inspired by Walden Pond, where writer Henry David Thoreau pursued a creative lifestyle, reflecting Mr. Tan’s spirit of innovation and willingness to take risks. Under his leadership, the fund has made many bold investments in startups.

In addition to his role at Intel, Mr. Tan currently serves on the boards of major corporations such as Schneider Electric SE and Credo Semiconductor.

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Lip-Bu Tan's innovative spirit and willingness to take risks are considered suitable to steer Intel. Photo: Intel

Semiconductor design experience

His leadership experience at Cadence Design Systems gives Mr. Tan a deep understanding of the chip design process - a core area for Intel.

In addition, his venture capital background gives him the ability to identify and partner with potential startups, especially in key areas such as AI and advanced chip manufacturing.

In his first message to Intel employees, he stressed the importance of "reinventing the company for the future," focusing on key areas such as improving manufacturing technology and enhancing the customer experience.

This shows that he has a specific strategy to address current challenges, including competing with TSMC in chip manufacturing and confronting Nvidia in the AI ​​market.

Currently, Intel is facing many difficulties as it is far behind TSMC in semiconductor manufacturing technology and cannot compete effectively with Nvidia in the field of AI.

Compared to Pat Gelsinger - who pursued an ambitious but costly expansion strategy - Lip-Bu Tan may bring a more balanced approach, combining technological innovation and tight financial management.

Intel faces a 'split' future Broadcom and TSMC are considering a number of potential deals with Intel, which if they happen could split the one-time semiconductor giant.