The Hanoi Stock Exchange (HNX) has just issued a document announcing information on the results of the private bond offering of Vietnam Technological and Commercial Joint Stock Bank (Techcombank - HoSE: TCB).
Accordingly, Techcombank successfully issued 2 lots of bonds with code TCBL2325009 on November 19 and bonds with code TCBL2325008 on November 18.
The two above bond lots each have a volume of 2,000 bonds, with a face value of VND 1 billion/bond, equivalent to a total issuance volume of VND 2,000 billion. The issuance market is the domestic market, with a term of 2 years and an interest rate of 4.7%/year. Thus, Techcombank has successfully mobilized VND 4,000 billion from the two above bond lots.
Information on 2 bond lots successfully mobilized by Techcombank.
This is the 8th bond issuance of this bank this year. Previously, at the end of October, Techcombank also successfully mobilized 1,500 bonds coded TCBL2325007 with a face value of 1 billion VND/bond, equivalent to a total issuance value of 1,500 billion VND. The bond lot was also issued in the domestic market with an interest rate of 5%/year.
The bonds issued by Techcombank this year all have a term of 2-3 years, with a face value of VND1 billion/bond, and are issued in the domestic market with interest rates ranging from 4.7% - 7.2%.
Of which, the bond lot with the largest value issued by the bank this year is TCBL2326003 with a total issuance value of VND5,000 billion. Thus, through 8 bond issuances, Techcombank has mobilized a total of VND19,500 billion.
On the other hand, this year, the bank also conducted 7 early bond buybacks of bonds issued in 2022 and expected to mature in 2025, with a face value of VND1 billion/bond. Techcombank spent about VND6,100 billion to buy back these bonds.
According to information from HNX, in the first half of 2023, Techcombank spent about VND 444 billion to pay bond interest and VND 5,000 billion to pay bond principal .
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