Some recent sources said that Apple is looking to launch the ultra-thin iPhone 17 in 2025. However, it seems that this plan of the iPhone maker is having problems.
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| Apple faces difficulties in producing super thin iPhone 17 |
According to analyst Ming-Chi Kuo, Apple is said to have canceled plans to use Resin-Coated Copper (RCC) for the main circuit board on the iPhone 17 series to be launched next year.
Using RCC components would allow the company to cut down on internal space requirements, allowing for a thinner design or even larger batteries for future iPhones.
However, it seems that concerns about durability and fragility are behind Apple's decision to delay. Mr. Kuo said, "RCC cannot meet Apple's high quality requirements. Therefore, "Apple" was forced to cancel the plan to apply this material to the iPhone 17 product line."
According to some previous sources, Apple is said to use a new design on the iPhone 16 series. However, the changes have been delayed until the iPhone 17, with the goal of reserving the iPhone 17 Slim to replace the iPhone Plus series with weak sales.
Currently, the iPhone manufacturer continues to delay these upgrades for an unspecified period of time. iFans will have to wait even longer to enjoy an iPhone with an ultra-thin design.
Source: https://baoquocte.vn/apple-tri-hoan-viec-ra-mat-iphone-17-sieu-mong-279183.html
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