MediaTek announces the Dimensity 7300 and Dimensity 7300X chips.

MediaTek has announced the Dimensity 7300 and Dimensity 7300X, a pair of ultra-efficient 4nm chipsets for high-tech mobile devices.

MediaTek's Dimensity 7300

Both Dimensity 7300 chipsets feature an 8-core CPU, consisting of 4 Arm Cortex-A78 cores running at 2.5GHz combined with 4 Arm Cortex-A55 cores. The 4nm process reduces the power consumption of the A78 cores by up to 25% compared to the Dimensity 7050.

The CPU works in conjunction with the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizer to accelerate the gaming experience. Compared to competing solutions, the Dimensity 7300 series delivers 20% faster FPS and 20% improved energy efficiency.

To further enhance the gaming experience, these new chips utilize intelligent resource optimization technology, optimize 5G and Wi-Fi gaming connectivity, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

“MediaTek Dimensity 7300 chips will play a crucial role in integrating the latest AI advancements and connectivity features, enabling consumers to stream and game smoothly,” said Dr. Yenchi Lee, Vice President of Wireless Communications Business at MediaTek. “Furthermore, the Dimensity 7300X allows OEMs to develop innovative new form factors thanks to its dual-display support,” Dr. Lee added.

The Dimensity 7300 chipset also boasts upgraded imaging capabilities with the MediaTek Imagiq 950, featuring advanced 12-bit HDR-ISP supporting main cameras up to 200MP. Enhanced with new hardware tools delivering accurate noise reduction (MCNR), face detection (HWFD), and HDR video , the Dimensity 7300 allows users to capture stunning photos and videos in any lighting condition.

Additionally, it offers up to 1.3 times faster autofocus performance and up to 1.5 times faster image reproduction compared to the Dimensity 7050. Users can also shoot 4K HDR video with a 50% wider dynamic range than competing solutions, resulting in more detail in the video.

Other technologies of the Dimensity 7300 and Dimensity 7300X include:

MediaTek 5G UltraSave 3.0+ technology combines a complete R16 energy-saving suite, plus MediaTek's own optimization measures, to deliver 13-30% higher energy efficiency than competing solutions in common sub-6GHz 5G connectivity scenarios.

Supports 5G download speeds up to 3.27Gb/s thanks to 3CC Carrier Aggregation technology, providing faster download speeds in urban and suburban environments.

It supports tri-band Wi-Fi 6E for fast and reliable multi-gigabit wireless connectivity and dual 5G SIM support with dual VoNR, giving users more choices.

KIM THANH

Source: https://www.sggp.org.vn/mediatek-cong-bo-chip-dimensity-7300-va-dimensity-7300x-post742221.html