5G and satellite network component developers are creating next-generation front-end radio modules using mmWave frequency bands, which present significant design and simulation challenges. These frequencies are susceptible to signal loss due to propagation characteristics, atmospheric attenuation, complex packaging issues, and issues with noise and dynamic range. The design challenges for 6G are even greater, with operations at higher frequencies using sub-THz signals.
Keysight is developing solutions to accelerate 5G and 6G technology
Designers of monolithic integrated circuits (MMICs) and microwave modules are combining multiple semiconductor and III-V processes at mmWave frequencies, requiring multiple die assembly, module-level interconnects, and power calculations. The mmWave power amplifier is fabricated separately from the rest of the design to minimize thermal, yield, and semiconductor performance issues. Additionally, the power amplifier is fabricated on gallium nitride processes that handle higher current densities than silicon.
New semiconductor packaging techniques, such as flip-chip bonding, enable higher densities and performance. These packages also need to be co-designed across multiple technologies and processes because they must address a variety of issues such as internal crosstalk, electromagnetic interference (EMI), stability, and operating temperatures.
The latest version of Keysight's industry-leading microwave and radio frequency (RF/uW) design software suite addresses these development challenges with improvements in algorithms, component layout, thermal-electrical, and workflow automation.
RFPro in PathWave ADS 2024 brings workflows into a unified EM circuit co-design dashboard, where design engineers can perform EM simulation to refine and optimize designs early in the development cycle, said Joe Civello, PathWave ADS product manager at Keysight. ADS supports multi-technology design and analyzes thermal, EM, and parasitic signals across circuits and signal modulation. The solution enables rapid assembly of circuits, MMICs, packaging, interconnects, and module layout to significantly improve mmWave engineering design performance.
Source link
Comment (0)