SGGPO
MediaTek has officially launched the new Dimensity 6000+ series along with a chipset designed to power the next generation of mass-market 5G devices.
MediaTek Dimensity 6100+ Chipset |
The Dimensity 6100+ chipset delivers premium features, including exceptional power efficiency, vibrant displays, high frame rates, AI-powered camera technology, industry-leading low power consumption, and reliable sub-6 5G connectivity at a price point accessible to smartphone manufacturers.
Other features of the Dimensity 6100+ chipset include: Support for Non-ZSL cameras up to 108MP; Support for video recording up to 2K 30fps; UltraSave 3.0+ technology reduces 5G power consumption by 20% compared to competing solutions; Powerful camera features, including AI-bokeh for stunning portraits and selfies; In partnership with Arcsoft, MediaTek is also bringing AI-color technology to mainstream devices so users can express their creativity; Support for premium 10-bit displays: Reproduces over a billion colors for vivid images and videos, along with support for 90Hz to 120Hz frame rates for a smooth user experience.
The Dimensity 6100+ integrates an advanced 5G modem that supports the 3GPP Release 16 standard with 5G 2CC Carrier Aggregation up to 140MHz, significantly reducing power consumption with MediaTek UltraSave 3.0+ technology. The chip features two Arm Cortex-A76 large cores and six Arm Cortex-A55 efficiency cores, delivering notable improvements, including AI camera support, 10-bit display, superior UX and GPU performance, and rich peripheral features.
“As developing countries continue to rapidly deploy 5G networks and operators in developed countries work to complete the consumer transition from 4G LTE to 5G, the need for chipsets to power the growing number of feature-packed mobile devices has never been more urgent,” said CH Chen, Vice President of MediaTek’s Wireless Communications Business Unit.
Source
Comment (0)